KUANFANG, H.; QING, Y.; DONGMING, X.; XUEJUN, L. Thermal Analysis of a Cracked Half-plane under Moving Point Heat Source. International Journal of Engineering and Technology Innovation, [S. l.], v. 7, n. 4, p. 269–279, 2017. Disponível em: https://ojs.imeti.org/index.php/IJETI/article/view/381. Acesso em: 20 apr. 2024.