Kuanfang, H., Y. Qing, X. Dongming, and L. Xuejun. “Thermal Analysis of a Cracked Half-Plane under Moving Point Heat Source”. International Journal of Engineering and Technology Innovation, vol. 7, no. 4, Sept. 2017, pp. 269-7, https://ojs.imeti.org/index.php/IJETI/article/view/381.