Lee, Woei-Shyan, Tao-Hsing Chen, Chi-Feng Lin, and Yu-Liang Chuang. “Nano-Mechanical Behaviour and Microstructural Evolution of Cu/Si Thin Films at Different Annealing Temperatures”. International Journal of Engineering and Technology Innovation 2, no. 3 (July 1, 2012): 207–215. Accessed April 25, 2024. https://ojs.imeti.org/index.php/IJETI/article/view/82.