HSU, H.-C.; WANG, S.-Y.; CHU, L.-M. A Study on Aluminum Pad Large Deformation during Copper Wirebonding for High Power IC Package. Advances in Technology Innovation, [S. l.], v. 3, n. 2, p. 51–58, 2018. Disponível em: https://ojs.imeti.org/index.php/AITI/article/view/1026. Acesso em: 22 nov. 2024.