Hsu, H.-C., S.-Y. Wang, and L.-M. Chu. “A Study on Aluminum Pad Large Deformation During Copper Wirebonding for High Power IC Package”. Advances in Technology Innovation, Vol. 3, no. 2, Feb. 2018, pp. 51-58, https://ojs.imeti.org/index.php/AITI/article/view/1026.