Hsu, Hsiang-Chen, Shaw-Yuan Wang, and Li-Ming Chu. “A Study on Aluminum Pad Large Deformation During Copper Wirebonding for High Power IC Package”. Advances in Technology Innovation 3, no. 2 (February 20, 2018): 51–58. Accessed November 22, 2024. https://ojs.imeti.org/index.php/AITI/article/view/1026.