Bonnaud, Olivier, Yves Danto, Ying-Hui Kuang, and Li Yuan. “International Flipped Class for Chinese Honors Bachelor Students in the Frame of Multidisciplinary Fields: Reliability and Microelectronics”. Advances in Technology Innovation 3, no. 3 (March 1, 2018): 126–132. Accessed May 28, 2024. https://ojs.imeti.org/index.php/AITI/article/view/1018.