TY - JOUR
AU - Kuanfang, He
AU - Qing, Yang
AU - Dongming, Xiao
AU - Xuejun, Li
PY - 2017/09/19
Y2 - 2024/06/20
TI - Thermal Analysis of a Cracked Half-plane under Moving Point Heat Source
JF - International Journal of Engineering and Technology Innovation
JA - Int. j. eng. technol. innov.
VL - 7
IS - 4
SE - Articles
DO -
UR - https://ojs.imeti.org/index.php/IJETI/article/view/381
SP - 269-279
AB - <p class="IndexTerms">The heat conduction in half-plane with an insulated crack subjected to moving point heat source is investigated. The analytical solution and the numerical means are combined to analyze the transient temperature distribution of a cracked half-plane under moving point heat source. The transient temperature distribution of the half plane structure under moving point heat source is obtained by the moving coordinate method firstly, then the heat conduction equation with thermal boundary of an insulated crack face is changed to singular integral equation by applying Fourier transforms and solved by the numerical method. The numerical examples of the temperature distribution on the cracked half-plane structure under moving point heat source are presented and discussed in detail.</p>
ER -