LEE, W.-S.; CHEN, T.-H.; LIN, C.-F.; CHUANG, Y.-L. Nano-mechanical Behaviour and Microstructural Evolution of Cu/Si Thin Films at Different Annealing Temperatures. International Journal of Engineering and Technology Innovation, [S. l.], v. 2, n. 3, p. 207–215, 2012. Disponível em: https://ojs.imeti.org/index.php/IJETI/article/view/82. Acesso em: 28 mar. 2024.