Innovation for Education on Internet of Things
Keywords:innovation, internet of things, microelectronics, nanotechnologies, education
The Internet of Things (IoT) and related objects are becoming more prevalent around the world with exponential growth for the next fifteen years. This evolution implies innovation in many fields of technology, whose core is in microelectronics. Indeed, IoT deals with all societal applications such as health, the environment, transport, energy and communications. Thus, connected objects involve many technological components: sensors and actuators, signal processing circuits, data transmission circuits and systems, energy recovery systems, which directly depend on the performance of microelectronics. To create new connected objects, innovation is the main driver. Innovation results from the combination of a multidisciplinary approach, links between disciplines and the necessary know-how of engineers and technicians. This paper deals with the orientation of pedagogy towards these objectives through the development of dedicated and innovative platforms in microelectronics. These platforms are developed by the French National Microelectronics Education Network (CNFM). After presenting the context of IoT and the evolution of microelectronics technologies, this article highlights the main components of connected objects applied to many societal applications. Each component of the objects requires specific microelectronic devices or circuits. Innovation appears in the nature of platforms, the multidisciplinary approach of training, the permanent links between disciplines, and the adaptation to new educational tools, mainly online. The results of the training on innovative platforms are presented and discussed.
O. Bonnaud and L. Fesquet, “Communicating and smart objects: multidisciplinary topics for the innovative education in microelectronics and its applications,” Proc. of 15th International Conf. Information Technology Based Higher Education and Training, IEEE Press, August 2015, pp. 1-5
G. Matheron, Keynote, Microelectronics evolution, European, Microelectronics Summit, Paris, November 2014.
O. Bonnaud and L. Fesquet, “MOOC and the Practice in electrical and information engineering: complementary approaches,” Proc. of 16th International Conference on Information Technology Based Higher Education and Training, IEEE Press, December 2016, pp. 1-4.
O. Bonnaud and L. Fesquet, “Innovation in higher education: specificity of the microelectronics field,” Proc. of 31st Symposium on Microelectronics Technology and Devices (SBMicro 2016), August 2016, pp. 119-122.
O. Bonnaud and L. Wei, “A way to introduce Innovative approach in the field of Microelectronics and nanotechnologies in the Chinese Education system,” Proceedings of Engineering and Technology Innovation, vol. 4, pp. 19-21, 2016.
O. Bonnaud and L. Fesquet, Towards multidisciplinarity for microelectronics education: a strategy of the French national network, Proc. of 2015 IEEE International Conf. Microelectronics Systems Education, IEEE Press, May 2015, pp. 1-4.
“CNFM: National Coordination for Education in Microelectronics and Nanotechnologies,” www.cnfm.fr.
O. Bonnaud, P. Gentil, A. Bsiesy, S. Retailleau, E. Dufour-Gergam, and J. M. Dorkel, “GIP-CNFM: a French education network moving from microelectronics to nanotechnologies,” Proc. of IEEE Global Engineering Education Conference, IEEE Press, April 2011, pp. 122-127.
“Industry 4.0: the fourth industrial revolution - guide to Industrie 4.0,” https://www.i-scoop.eu/industry-4-0/, February 2018.
O. Bonnaud, “New challenges for higher education in the microelectronics field,” Proc. of 10th annual International Conference of Education, Research and Innovation 2017, November 2017, pp. 7666-7675.
G. Fettweis, “On platform design for 5G signal processing implementation,” Keynote of Latin America Symposium on Circuits and Systems, February 2018.
G. Fettweis, “5G technology breaking grounds from thingbook to the tactile internet,” http://www.5gsummit.org/ docs/slides/Gerhard-Fettweis-5GSummit-SiliconValley-11162015.pdf, February 2018.
“Tsunami of dat could consume one fifth of global electricity by 2025,” https://www.theguardian.com/environment/2017/dec/11/tsunami-of-data-could-consume-fifth-global-electricity-by-2025, February 2018.
G. E. Moore, “Cramming more components onto integrated circuits,” Electronics Magazine, vol. 38, no. 8, pp. 114-117, April 1965.
“FinFET,” https://www.computerhope.com/jargon/f/finfet.htm, April 2017.
T. Simonite, “Moore’s law is dead. now what? ,” https://www.technologyreview.com/s/601441/moores-law-is-dead-now-what/, May 13, 2016.
M. Swaminathan and J. M. Pettit, 3rd System integration workshop, 2011.
O. Bonnaud et al., “Microelectronics online course,” https://microelectronique.univ-rennes1.fr/index21.html, 2013.
A. Fox, “From MOOCs to SPOCs,” Communications of the ACM, vol. 56, no. 12, pp. 38-40, December 2013.
L. Stuchlikova, A. Kosa, P. Benko, and D. Donoval, “Massive open online courses in microelectronics education,” Proc. 10th European Workshop on Microelectronics Education, IEEE Press, May 2014, pp. 31-36.
O. Bonnaud, Y. Danto, Y. H. Kuang, and L. Yuan, “International flipped class for chinese honors bachelor students in the frame of multidisciplinary fields: reliability and microelectronics,” Advances in Technology Innovation, vol. 3, no. 3, pp. 126-132, 2018.
“ACSIEL components and systems alliance for electronics industry,” http://www.acsiel.fr/en-GB/index.aspx.
“FIEEC. Federation of electronics, electrics and communication industries,” http://www.fieec.fr.
“CGI: Commissariat Général aux Investissements,” http://investissementsdavenir.bpifrance.fr/commissariat_general_a_l_ investissement.
FINMINA: Formations Innovantes en Microélectronique et Nanotechnologies (Innovation Education in Microelectronics and Nanotechnologies). IDEFI progam: Excellence Initiative for Innovation in Education. See website of CNFM, IDEFI project: ANR-11-IDFI-0017, 2011.
O. Bonnaud, “New approach for sensors and connecting objects involving microelectronic multidisciplinarity for a wide spectrum of applications,” International Journal of Plasma Environmental Science & Technology, vol. 10, no. 2, pp. 115-120, 2016
O. Bonnaud and L. Fesquet, “Innovative practice in the French microelectronics education targeting the industrial needs,” Proc. of IEEE Microelectronics System Conference, IEEE Press, May 2017, pp. 15-18.
How to Cite
Submission of a manuscript implies: that the work described has not been published before that it is not under consideration for publication elsewhere; that if and when the manuscript is accepted for publication. Authors can retain copyright of their article with no restrictions. Also, author can post the final, peer-reviewed manuscript version (postprint) to any repository or website.
Since Oct. 01, 2015, PETI will publish new articles with Creative Commons Attribution Non-Commercial License, under The Creative Commons Attribution Non-Commercial 4.0 International (CC BY-NC 4.0) License.
The Creative Commons Attribution Non-Commercial (CC-BY-NC) License permits use, distribution and reproduction in any medium, provided the original work is properly cited and is not used for commercial purposes