Adaptation of the Higher Education in Engineering to the Advanced Manufacturing Technologies
The 21st century will be the era of the fourth industrial revolution with the progressive introduction of the digital society, with smart/connected objects, smart factories driven by robotics, the Internet of Things (IoT) and artificial intelligence. Manufacturing should be performed by the industry entitled 4.0. These are advanced technologies resulting from steady development of information technology associated with new objects and systems that can fulfil manufacturing tasks. The industry 4.0 concept relies largely on the ability to design and manufacture smart and connected devices that are based on microelectronics technology. This evolution requires highly-skilled technicians, engineers and PhDs well prepared for research, development and manufacturing. Their training, which combines knowledge and the associated compulsory know-how, is becoming the main challenge for the academic world. The curricula must therefore contain the basic knowledge and associated know-how training in all the specialties in the field. The software and hardware used in microelectronics and its applications are becoming so complex and expensive that the most realistic solution for practical training is to share facilities and human resources. This approach has been adopted by the French microelectronics education network, which includes twelve joint university centres and 2 industrial unions. It makes it possible to minimize training costs and to train future graduates on up-to-date tools similar to those used in companies. Thus, this paper deals with the strategy adopted by the French network in order to meet the needs of the future industry 4.0.
H. Chaouchi, “The Internet of Things: Connecting Objects,” ISTE Ltd, John Wiley & Sons, May 2010.
M. Burgess, “What is the Internet of Things?,” WIRED Magazine, https://www.wired.co.uk/article/internet-of-things-what-is-explained-iot, February 16, 2018.
G. E. Moore, “Cramming more components onto integrated circuits,” Electronics Magazine, vol. 38, no. 8, pp. 114-117, 1965.
V. Sharma and R. Tiwari, “A review paper on “IOT” & Its Smart Applications,” International Journal of Science, Engineering and Technology Research, vol. 5, no. 2, February 2016.
A. Schütze, N. Helwig, and T. Schneider,“Sensors 4.0-smart sensors and measurement technology enable Industry 4.0,” Journal of Sensors and Sensor Systems, vol. 7, no. 1, pp. 359-371, May 2018.
O. Bonnaud, “New Approach for Sensors and Connecting Objects Involving Microelectronic Multidisciplinarity for a Wide Spectrum of Applications,” International Journal of Plasma Environmental Science and Technology, vol. 10, no. 2, pp. 115-120, December 2016.
G. Matheron, “Microelectronics evolution, Keynote, European, Microelectronics Summit,” Paris, France, November 2014.
B. P. Santos, F. C. Santos, and T. M. Lima, “Industry 4.0: an overview,” Proceedings of the World Congress on Engineering, vol. 2, 2018.
M. Peshkin and J. E. Colgate, “Cobots,” Industrial Robot, vol. 26, no. 5, pp. 335-341, 1999.
Å. F. Berglund, F. Palmkvist, P. Nyqvist, S. Ekered, and M. Åkerman, “Evaluating Cobots for Final Assembly,” Procedia CIRP, vol. 44, pp. 175-180, 2016.
O. Bonnaud and L. Fesquet, “Practice in microelectronics education as a mandatory complement to the future numeric-based pedagogy: a strategy of the French national network,” International KES Conference on Smart Education and Smart E-Learning, Springer, Cham, pp. 1-8, May 2016.
M. McKellop, “The future of the semiconductor industry is the Internet of Things,” The Burn-In, https://www.theburnin.com/industry/semiconductors-internet-of-things/, November 28, 2018.
R. R. Tummala and M. Swaminathan, System on Package, Miniaturization of the Entire System, McGraw-Hill Education, The1st edition, May 2008.
T. Simonite, “Moore’s Law Is Dead. Now What?,” MIT Technology Review, https://www.technologyreview.com/s/601441/moores-law-is-dead-now-what/, May 13, 2016.
O. Bonnaud, “The Multidisciplinary Approach: A Common Trend For ULSI and Thin Film Technology,” ECS Transaction, vol. 67, no. 1, pp. 147-158, 2015.
Technopedia, “Internet of Everything (IoE),” https://www.techopedia.com/definition/30121/internet-of-everything-ioe, 2019.
IDC, “What the IoT market has in store for Europe in 2019,” https://uk.idc.com/trends/predictions, January 30, 2019
Enerdata, “Global Energy Statistical Yearbook 2019,” https://yearbook.enerdata.net/total-energy/world-energy-production.html, March 2019.
International Energy Agency, “World Energy Outlook 2019,” https://www.iea.org, January 2019.
Enerdata, “World Energy Production,” https://yearbook.enerdata.net/total-energy/world-energy-production.html, 2019.
CNFM, “Coordination Nationale pour la formation en Microélectronique et nanotechnologies,” www.cnfm.fr; GIP-CNFM, March 2019.
O. Bonnaud, P. Gentil, A. Bsiesy, S. Retailleau, E. D. Gergam, and J. M. Dorkel,“GIP-CNFM: a French education network moving from microelectronics to nanotechnologies,” Proceeding of IEEE Global Engineering Education Conference; Amman, Jordan, pp. 122-127, April 2011.
ACSIEL Alliance Électronique, “Components and systems alliance for electronics industry in France,” http://www.acsiel.fr/en-GB/index.aspx, 2019.
O. Bonnaud, “Practice-oriented pedagogical strategy of the French microelectronics and nanotechnologies network,” 14th International Conference on Education and educational Technology, Kuala-Lumpur, Malaysia, pp. 11-19, April 2015.
A. Fox, “From MOOCs to SPOCs,” Communications of the ACM, vol. 56, no. 12, pp. 38-40, 2013.
O. Bonnaud and L. Fesquet, “MOOC and the Practice in electrical and information engineering: complementary approaches,” 15th International Conference on Information Technology Based Higher Education and Training, Istanbul, Turkey, September 2016.
O. Bonnaud, “Knowledge and know-how in microelectronics; strategy of innovative practice to balance the new on-line courses approach,” International Conference on Advanced Technology Innovation, Koh Samui, Thailand, pp. 10-11, June 2017.
FINMINA, “Formations Innovantes en Microélectronique et Nanotechnologies,” http://www.cnfm.fr/?q=fr/pr%C3%A9sentation_FINMINA, Innovative Training for Microelectronics and Nanotechnologies March 2019.
O. Bonnaud, L. Fesquet, P. Nouet, and T. M. Brahim, “FINMINA: a French national project to promote Innovation in Higher Education in Microelectronics and Nanotechnologies,” International Conference on Information Technology Based Higher Education and Training, York, UK, Proceeding of ITHET 2014, September 11-13, 2014.
O. Bonnaud, “New Vision in Microelectronics Education: Smart e-Learning and Know-how, a Complementary Approach,” International KES Conference on Smart Education and Smart E-Learning, pp. 267-275, 2019.
F. Bruguier, P. Benoit, L. Dalmasso, B. Pradarelli, and L. Torres, “AMUSE: un escape game pour l’enseignement de la sécurité numérique,”, Proceeding of 15th JPCNFM 2018, Saint-Malo, France, vol.15, November 2018. (French)
O. Bonnaud, Y. Danto, Y.Kuang,and Y. Li, “International flipped class for Chinese Honors Bachelor students in the frame of multidisciplinary fields: reliability and microelectronics,” Advanced In Technology Innovation, vol. 3, no. 3, pp. 126-132, 2018.
O. Bonnaud and L. Fesquet, “Innovation for education on Internet of things,” Proceeding of Engineering and Technology Innovation, vol. 9, pp. 1-8, 2018.
O. Bonnaud and L. Fesquet, “Communicating and smart objects: multidisciplinary topics for the innovative education in microelectronics and its applications,” Proceeding of 15th International Conference Information Technology Based Higher Education and Training, IEEE Press, pp. 1-5, August 2015.
O. Bonnaud, “Mandatory Matching Between Microelectronics Industry and Higher Education in Engineering Toward a Digital Society,” Smart Education and e-Learning 2019, Springer, Singapore, vol. 24, pp. 255-266, 2020.
Copyright (c) 2020 Olivier Bonnaud, Ahmad Bsiesy
This work is licensed under a Creative Commons Attribution-NonCommercial 4.0 International License.
Submission of a manuscript implies: that the work described has not been published before that it is not under consideration for publication elsewhere; that if and when the manuscript is accepted for publication. Authors can retain copyright in their articles with no restrictions. is accepted for publication. Authors can retain copyright of their article with no restrictions.
Since Jan. 01, 2019, AITI will publish new articles with Creative Commons Attribution Non-Commercial License, under The Creative Commons Attribution Non-Commercial 4.0 International (CC BY-NC 4.0) License.
The Creative Commons Attribution Non-Commercial (CC-BY-NC) License permits use, distribution and reproduction in any medium, provided the original work is properly cited and is not used for commercial purposes.