Innovative Strategy to Meet the Challenges of the Future Digital Society
Keywords:digital society, microelectronics, multidisciplinarity, energy challenge, higher education training
Today, we are experiencing a societal revolution with the development of digital technologies, and it brings new challenges. Indeed, the number of connected objects, intelligent sensors and IoTs are increasing exponentially. The same goes for the resulting energy consumption. Beyond 2030, without a radical transformation of communication technologies and protocols, the digital world will be at an energy dead end. All these objects are physically realized with microelectronic devices and systems. This analysis of the microelectronics community has led the French government to recognize an electronics sector that is becoming a priority area of industrial policy. The Strategic Committee of this sector has proposed innovations applied to the entire digital chain including all facets of the microelectronics field and human skills and know-how. The technological and energy issues are thus presented, and the proposed solutions were addressed. They concern both technological and human aspects. This paper ends by giving examples of the implementation of innovative approaches which essentially include the electronic functions involved in connected objects and which are intended to bring the know-how of future actors in the field.
M. Burgess, “What is the Internet of Things?” WIRED Magazine, https://www.wired.co.uk/article/internet-of-things-what-is-explained-iot, February 16, 2018.
A. Schütze, N. Helwig, and T. Schneider, “Sensors 4.0-Smart Sensors and Measurement Technology Enable Industry 4.0,” Journal of Sensors and Sensor Systems, vol. 7, no. 1, pp. 359-371, May 2018.
R. Smith, “The Future of Manufacturing: Cobots in the Factory,” https://www.tctmagazine.com/tctblogs/guest-blogs/the-future-of-manufacturing-cobots-in-the-factory/, March 04, 2019.
O. Bonnaud and L. Fesquet, “Microelectronics at the Heart of the Digital Society: Technological and Training Challenges,” SBMicro, IEEExplore, August 2018, pp. 1-4.
E. Gelenbe and Y. Caseau, The Impact of Information Technology on Energy Consumption and Carbon Emissions, ACM publication, June 2015, pp. 1-15, https://dl.acm.org/doi/pdf/10.1145/2755977.
T. Tingaud, “La Filière Industries de l’Electronique,” https://www.conseil-national-industrie.gouv.fr/la-filiere-industries-de-l-electronique.
O. Bonnaud, “Mandatory Matching Between Microelectronics Industry and Higher Education in Engineering toward a Digital Society,” Smart Education and E-Learning 2019, Springer, vol. 24, pp. 255-266, June 2019.
“Signature by the Minister,” https://www.economie.gouv.fr/signature-contrat-comite-strategique-filiere-industrie-electronique-plan-nano-2022.
O. Bonnaud and L. Fesquet, “Innovation for Education on Internet of Things,” Proceedings of Engineering and Technology Innovation, vol. 9, pp. 1-8, July 2018.
G. E. Moore, “Cramming more Components onto Integrated Circuits,” Electronics Magazine, vol. 38, no. 8, pp. 114-117, April 1965.
K. Cheval, J. Coulm, S. Gout, Y. Layouni, P. Lombard, D. Leonard, et al., “Progress in the Manufacturing of Molded Interconnected Devices by 3D Microcontact Printing,” Advanced Materials Research, vol. 1038, pp. 57-60, September 2014.
R. R. Tummala and M. Swaminathan, System on Package: Miniaturization of the Entire System, 1st ed. McGraw-Hill, 2008.
O. Bonnaud, “New Approach for Sensors and Connecting Objects Involving Microelectronic Multidisciplinarity for a Wide Spectrum of Applications,” International Journal of Plasma Environmental Science and Technology, vol. 10, no. 2, pp. 115-120, December 2016.
J. Bryzek, “The Trillion Sensors (TSensors) Foundation for the IoT,” https://www.iot-inc.com/wp-content/uploads/2015/11/2-Janusz.pdf, 2015.
Enerdata, “Global Energy Statistical Yearbook 2019,” https://yearbook.enerdata.net/total-energy/world-energy- production.html, March 2019.
M. Greenfield, “Internet Des Objets (IoT): Nombre D'appareils Connectés Dans Le Monde De 2015 à 2025,” https://fr.statista.com/statistiques/584481/internet-des-objets-nombre-d-appareils-connectes-dans-le-monde--2020/
Enerdata, “World Energy Production,” https://yearbook.enerdata.net/total-energy/world-energy-production.html, 2020.
O. Bonnaud and A. Bsiesy, “Adaptation of the Higher Education in Engineering to the Advanced Manufacturing Technologies,” Advances in Technology Innovation, vol. 5, no. 2, pp. 65-75, April 2020.
O. Bonnaud, “Knowledge and Know-How in Microelectronics; Strategy of Innovative Practice to Balance the New On-line Courses Approach,” International Conference on Advances in Technology Engineering, June 2017, pp. 10-11.
O. Bonnaud and L. Fesquet, “Communicating and Smart Objects: Multidisciplinary Topics for the Innovative Education in Microelectronics and its Applications,” 15th International Conference Information Technology Based Higher Education and Training, IEEE Press, August 2015, pp. 1-5.
CNFM: “Coordination Nationale Pour La Formation En Microélectronique and Nanotechnologies,” www.cnfm.fr, December 2020.
O. Bonnaud, P. Gentil, A. Bsiesy, S. Retailleau, E. D. Gergam, and J. M. Dorkel, “GIP-CNFM: A French Education Network Moving from Microelectronics to Nanotechnologies,” IEEE Global Engineering Education Conference, April 2011, pp. 122-127.
ACSIEL Alliance Électronique, “Components and Systems Alliance for Electronics Industry in France,” http://www.acsiel.fr/en-GB/index.aspx, 2019.
B. Pradarelli, O. Bonnaud, P. Nouet, and P. Benoit, “CNFM: Innovative Single National Entry-Point for Lifelong Learning in Microelectronics,” Proceedings of EDULEARN, July 2019, pp. 1-3.
FINMINA, “Formations Innovantes en Microélectronique et Nanotechnologies,” http://www.cnfm.fr/?q=fr/presentation_FINMINA, March 2020.
O. Bonnaud, “FINMINA: A French National Project Dedicated to Educational Innovation in Microelectronics to Meet the Challenges of a Digital Society,” Smart Innovation, Systems and Technologies, vol. 188, pp. 31-44, June 2020.
O. Bonnaud and L. Fesquet, “Practice in microelectronics education as a mandatory supplement to the future digital-based pedagogy: Strategy of the French national network,” 2016 11th European Workshop on Microelectronics Education (EWME), Southampton, 2016, pp. 1-6.
O. Bonnaud, “New Vision in Microelectronics Education: Smart E-Learning and Know-How, A Complementary Approach,” Smart Innovation, Systems and Technologies, vol. 99, pp. 267-275, May 2018.
O. Bonnaud, “Introduction of the Multidisciplinary Know-How of the French National Training Network to Contribute to the Evolution of Microelectronic Technologies Towards Connected Objects,” 17th International Conference on Information Technology Based Higher Education and Training (ITHET), August 2018, pp. 1-4.
O. Bonnaud, “The Multidisciplinary Approach: A Common Trend for ULSI and Thin Film Technology,” ECS Transaction, vol. 67, no. 1, pp. 147-158, 2015.
O. Bonnaud and L. Fesquet, “Innovation in Higher Education: Specificity of the Microelectronics Field,” 31st Symposium on Microelectronics Technology and Devices, IEEE Press, September 2016, pp. 119-122.
O. Bonnaud and L. Wei, “A Way to Introduce Innovative Approach in the Field of Microelectronics and Nanotechnologies in the Chinese Education System,” Proceedings of Engineering and Technology Innovation, vol. 4, pp. 19-21, October 2016.
O. Bonnaud, Y. Danto, Y. H. Kuang, and L. Yuan, “International Flipped Class for Chinese Honors Bachelor Students in the Frame of Multidisciplinary Fields: Reliability and Microelectronics,” Advances in Technology Innovation, vol. 3, no. 3, pp. 126-132, March 2018.
How to Cite
Submission of a manuscript implies: that the work described has not been published before that it is not under consideration for publication elsewhere; that if and when the manuscript is accepted for publication. Authors can retain copyright in their articles with no restrictions. is accepted for publication. Authors can retain copyright of their article with no restrictions.
Since Jan. 01, 2019, AITI will publish new articles with Creative Commons Attribution Non-Commercial License, under The Creative Commons Attribution Non-Commercial 4.0 International (CC BY-NC 4.0) License.
The Creative Commons Attribution Non-Commercial (CC-BY-NC) License permits use, distribution and reproduction in any medium, provided the original work is properly cited and is not used for commercial purposes.