A Study on Aluminum Pad Large Deformation during Copper Wirebonding for High Power IC Package
In this paper, a 3-D finite element prediction on aluminum pad squeeze during copper wirebonding process for high power IC package is presented. ANSYS Parametric Design Language (APDL) has been implemented on modelling, mesh density, boundary condition (BC), impact stage and contact mode for first bond process. The ANSYS/LS-DYNA solver is applied to solve dynamics and LS-PREPOST is used to observe the predicted large plastic deformation on bond pad and stress on microstructure under pad. In view of high power IC package, larger diameter of copper wire is required for electric loading for its low cost. In this research, a large diameter of 2 mil (50 um) uncoated pure copper (4N) wire is applied to simulate first bond impact-contact process. As the scale double enlarged, the problems encountered in simulation are usually evident. Preliminary results on impact stage demonstrate that negative volume/hourglass on large distortion can be solved by tune-up inertial contact settings and mesh density. However, sever hourglass defect would occur on ultrasonic stage and remain a pending problem. A series of prediction has been conducted on first bond process during impact stage and the results can then be applied to the dynamic wirebonding assembly process.
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